Insulated Cu wire free air ball characterization

Microelectronics Reliability 2014 / 08 Vol. 54; Iss. 8

Insulated Cu wire free air ball characterization

Leong, HungYang, Yap, BoonKar, Khan, Navas, Ibrahim, Mohd Rusli, Tan, L.C.
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Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.03.015
Date:
August, 2014
File:
PDF, 2.08 MB
english, 2014
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