![](/img/cover-not-exists.png)
Void control during plating process and thermal annealing of through-mask electroplated copper interconnects
Zhu, Chunsheng, Ning, Wenguo, Li, Heng, Zheng, Tao, Xu, Gaowei, Luo, LeVolume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.12.019
Date:
April, 2014
File:
PDF, 1.54 MB
english, 2014