Void control during plating process and thermal annealing...

Void control during plating process and thermal annealing of through-mask electroplated copper interconnects

Zhu, Chunsheng, Ning, Wenguo, Li, Heng, Zheng, Tao, Xu, Gaowei, Luo, Le
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Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.12.019
Date:
April, 2014
File:
PDF, 1.54 MB
english, 2014
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