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Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50μm Sn–Ag–Cu solder bumps
Huang, M.L., Yang, F., Zhao, N., Yang, Y.C.Volume:
602
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2014.03.047
Date:
July, 2014
File:
PDF, 978 KB
english, 2014