Thermal Analysis of Porous Pin Fin used for Electronic Cooling
Bhanja, Dipankar, Kundu, Balaram, Mandal, Pabitra KumarVolume:
64
Year:
2013
Language:
english
Journal:
Procedia Engineering
DOI:
10.1016/j.proeng.2013.09.172
File:
PDF, 344 KB
english, 2013