Fabrication of through-silicon vias by supercritical CO2...

Materials Science in Semiconductor Processing 2014 / 07 Vol. 23

Fabrication of through-silicon vias by supercritical CO2 emulsion-enabled nickel electroplating

Chuang, Ho-Chiao, Lai, Wei-Hong
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Volume:
23
Language:
english
Journal:
Materials Science in Semiconductor Processing
DOI:
10.1016/j.mssp.2014.02.025
Date:
July, 2014
File:
PDF, 1.35 MB
english, 2014
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