Using active thermography for defects inspection of flip chip
Xu, Zhensong, Shi, Tielin, Lu, Xiangning, Liao, GuanglanVolume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.12.015
Date:
April, 2014
File:
PDF, 3.60 MB
english, 2014