AlAl thermocompression bonding for wafer-level MEMS sealing

Sensors and Actuators A: Physical 2014 / 05 Vol. 211

AlAl thermocompression bonding for wafer-level MEMS sealing

Malik, N., Schjølberg-Henriksen, K., Poppe, E., Taklo, M.M.Visser, Finstad, T.G.
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Volume:
211
Language:
english
Journal:
Sensors and Actuators A: Physical
DOI:
10.1016/j.sna.2014.02.030
Date:
May, 2014
File:
PDF, 1.14 MB
english, 2014
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