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Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material
Otiaba, Kenny C., Okereke, M.I., Bhatti, R.S.Volume:
64
Language:
english
Journal:
Applied Thermal Engineering
DOI:
10.1016/j.applthermaleng.2013.12.006
Date:
March, 2014
File:
PDF, 3.95 MB
english, 2014