Evaluation of the wafer polishing pad capacity and lifetime...

International Journal of Machine Tools and Manufacture 2013 / 3 Vol. 66

Evaluation of the wafer polishing pad capacity and lifetime in the machining of reliable elevations

Lee, Eun-Sang, Cha, Ji-Wan, Kim, Seong-Hyun
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
66
Language:
english
Journal:
International Journal of Machine Tools and Manufacture
DOI:
10.1016/j.ijmachtools.2012.11.003
Date:
March, 2013
File:
PDF, 2.09 MB
english, 2013
Conversion to is in progress
Conversion to is failed