Thermomigration in solder joints

Materials Science and Engineering: R: Reports 2012 / 9 Vol. 73; Iss. 9-10

Thermomigration in solder joints

Chen, Chih, Hsiao, Hsiang-Yao, Chang, Yuan-Wei, Ouyang, Fanyi, Tu, K.N.
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Volume:
73
Language:
english
Journal:
Materials Science and Engineering: R: Reports
DOI:
10.1016/j.mser.2012.11.001
Date:
September, 2012
File:
PDF, 3.24 MB
english, 2012
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