Modeling Printed Circuit Board Curvature in Relation to Manufacturing Process Steps
Schuerink, G.A., Slomp, M., Wits, Wessel W., Legtenberg, R., Kappel, E.A.Volume:
9
Year:
2013
Language:
english
Journal:
Procedia CIRP
DOI:
10.1016/j.procir.2013.06.168
File:
PDF, 529 KB
english, 2013