Dilute H2SO4 solution for copper seed cleaning in electroplating
LEE, Youn-Seoung, YOON, Jae-Sik, JO, Yang-Rae, LEE, Heesoo, RHA, Sa-KyunVolume:
23
Language:
english
Journal:
Transactions of Nonferrous Metals Society of China
DOI:
10.1016/S1003-6326(13)62500-5
Date:
February, 2013
File:
PDF, 1.48 MB
english, 2013