Microstructural evolution and shear strength of AuSn20/Ni...

Microelectronics Reliability 2013 / 5 Vol. 53; Iss. 5

Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints

Wei, Xiao-feng, Zhang, Yu-kun, Wang, Ri-chu, Feng, Yan
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Volume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.01.005
Date:
May, 2013
File:
PDF, 1.25 MB
english, 2013
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