Intergranular fracture in copper under high temperature...

Intergranular fracture in copper under high temperature creep, fatigue and creep-fatigue conditions

Sklenička, V., Lukáš, P., Kunz, L.
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Volume:
24
Year:
1990
Language:
english
DOI:
10.1016/0956-716X(90)90548-U
File:
PDF, 362 KB
english, 1990
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