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Copper deposition and thermal stability issues in copper-based metallization for ULSI technology
Li, Jian, Shacham-Diamand, Y., Mayer, J.W.Volume:
9
Year:
1992
Language:
english
DOI:
10.1016/0920-2307(92)90011-O
File:
PDF, 22.34 MB
english, 1992