Mechanical analysis for crack-free release of chemical-vapor-deposited diamond wafers
Jeong, J.-h., Lee, S.-Y., Lee, W.-S., Baik, Y.-J., Kwon, D.Volume:
11
Language:
english
Journal:
Diamond and Related Materials
DOI:
10.1016/S0925-9635(02)00105-X
Date:
August, 2002
File:
PDF, 689 KB
english, 2002