Application of Electroless Fe−42Ni(P) Film for Under-bump Metallization on Solder Joint
Zhou, Haifei, Guo, Jingdong, Zhu, Qingsheng, Shang, JiankuVolume:
29
Language:
english
Journal:
Journal of Materials Science & Technology
DOI:
10.1016/j.jmst.2012.12.006
Date:
January, 2013
File:
PDF, 1.06 MB
english, 2013