Effects of pressure on electroplating of copper using...

Thin Solid Films 2013 / 2 Vol. 529

Effects of pressure on electroplating of copper using supercritical carbon dioxide emulsified electrolyte

Chang, Tso-Fu Mark, Shimizu, Tetsuya, Ishiyama, Chiemi, Sone, Masato
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Volume:
529
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2012.05.058
Date:
February, 2013
File:
PDF, 660 KB
english, 2013
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