On the crack and delamination risk optimization of a...

Microelectronics Reliability 2014 / 06 Vol. 54; Iss. 6-7

On the crack and delamination risk optimization of a Si-interposer for LED packaging

Auersperg, J., Dudek, R., Jordan, R., Bochow-Neß, O., Rzepka, S., Michel, B.
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Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.02.018
Date:
June, 2014
File:
PDF, 1.65 MB
english, 2014
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