Thermal analysis of encapsulants for tape automated bonded...

Thermochimica Acta 1992 Vol. 212; Iss. none

Thermal analysis of encapsulants for tape automated bonded (TAB) applications

Indira S. Adhihetty, Paul W. Deal, R.Paddy Padmanabhan
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
212
Year:
1992
Language:
english
Pages:
11
DOI:
10.1016/0040-6031(92)80239-s
File:
PDF, 745 KB
english, 1992
Conversion to is in progress
Conversion to is failed