Electroless Cu deposition on atomic layer deposited Ru as...

Electrochimica Acta 2013 / 6 Vol. 100

Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias

Inoue, Fumihiro, Philipsen, Harold, Radisic, Aleksandar, Armini, Silvia, Civale, Yann, Leunissen, Peter, Kondo, Muneharu, Webb, Eric, Shingubara, Shoso
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
100
Language:
english
Journal:
Electrochimica Acta
DOI:
10.1016/j.electacta.2013.03.106
Date:
June, 2013
File:
PDF, 3.94 MB
english, 2013
Conversion to is in progress
Conversion to is failed