A low temperature bonding process using deposited gold-tin...

A low temperature bonding process using deposited gold-tin composites

Chin C. Lee, Chen Y. Wang
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Volume:
208
Year:
1992
Language:
english
Pages:
8
DOI:
10.1016/0040-6090(92)90643-p
File:
PDF, 1.06 MB
english, 1992
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