Virtualized and fault-tolerant inter-layer-links for 3D-ICs

Microprocessors and Microsystems 2013 / 11 Vol. 37; Iss. 8

Virtualized and fault-tolerant inter-layer-links for 3D-ICs

Miller, Felix, Wild, Thomas, Herkersdorf, Andreas
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Volume:
37
Language:
english
Journal:
Microprocessors and Microsystems
DOI:
10.1016/j.micpro.2013.04.013
Date:
November, 2013
File:
PDF, 1.86 MB
english, 2013
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