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Supercritical fluid deposition of copper into mesoporous silicon
Jin, Lianhua, Kondoh, Eiichi, Oya, Toshifumi, Gelloz, BernardVolume:
545
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2013.08.034
Date:
October, 2013
File:
PDF, 873 KB
english, 2013