3D finite element modeling of 3D C2W (chip to wafer) drop test reliability: Optimization of internal architecture and materials
Belhenini, Soufyane, Tougui, Abdellah, Bouchou, Abdelhake, Dosseul, FranckVolume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.07.135
Date:
January, 2014
File:
PDF, 3.78 MB
english, 2014