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3D-Hot embossing of undercut structures $ndash; an approach to micro-zippers
BOGDANSKI, NVolume:
73-74
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/S0167-9317(04)00097-8
Date:
June, 2004
File:
PDF, 421 KB
english, 2004