Thermal stress and heat transfer characteristics of a...

Diamond and Related Materials 2009 / 2 Vol. 18; Iss. 2-3

Thermal stress and heat transfer characteristics of a Cu/diamond/Cu heat spreading device

Chen, Yi-Jiun, Young, Tai-Fa
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Volume:
18
Language:
english
Journal:
Diamond and Related Materials
DOI:
10.1016/j.diamond.2008.10.059
Date:
February, 2009
File:
PDF, 600 KB
english, 2009
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