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Thermal-stability optimization of Al2O3/Cu–Te based conductive-bridging random access memory systems
Goux, L., Opsomer, K., Franquet, A., Kar, G., Jossart, N., Richard, O., Wouters, D.J., Müller, R., Detavernier, C., Jurczak, M., Kittl, J.A.Volume:
533
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2012.10.103
Date:
April, 2013
File:
PDF, 1.60 MB
english, 2013