Localized Si–Au eutectic bonding around sunken pad for...

Sensors and Actuators A: Physical 2013 / 10 Vol. 201

Localized Si–Au eutectic bonding around sunken pad for fabrication of a capacitive absolute pressure sensor

Liu, Qimin, Du, Lidong, Zhao, Zhan, Xiao, Li, Sun, Xuejin
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Volume:
201
Language:
english
Journal:
Sensors and Actuators A: Physical
DOI:
10.1016/j.sna.2013.07.013
Date:
October, 2013
File:
PDF, 1.34 MB
english, 2013
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