The influence of abrasive particle size in copper chemical...

Surface and Coatings Technology 2013 / 9 Vol. 231

The influence of abrasive particle size in copper chemical mechanical planarization

Wei, Kuo-Hsiu, Wang, Yu-Sheng, Liu, Chuan-Pu, Chen, Kei-Wei, Wang, Ying-Lang, Cheng, Yi-Lung
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Volume:
231
Language:
english
Journal:
Surface and Coatings Technology
DOI:
10.1016/j.surfcoat.2012.04.004
Date:
September, 2013
File:
PDF, 485 KB
english, 2013
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