Dicing of Thin Si Wafers with a Picosecond Laser Ablation...

Physics Procedia 2013 Vol. 41

Dicing of Thin Si Wafers with a Picosecond Laser Ablation Process

Fornaroli, C., Holtkamp, J., Gillner, A.
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Volume:
41
Year:
2013
Language:
english
Journal:
Physics Procedia
DOI:
10.1016/j.phpro.2013.03.122
File:
PDF, 2.06 MB
english, 2013
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