Thermal and mechanical analysis of high-power GaAs flip-chips on CVD diamond substrates
Brown, M.D., Singh, S.B., Malshe, A.P., Gordon, M.H., Schmidt, W.F., Brown, W.D.Volume:
8
Language:
english
Journal:
Diamond and Related Materials
DOI:
10.1016/S0925-9635(99)00162-4
Date:
October, 1999
File:
PDF, 445 KB
english, 1999