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Impact of plasma treatment on structure and electrical properties of porous low dielectric constant SiCOH material
Cheng, Yi-Lung, Huang, Jun-Fu, Chang, Yu-Min, Leu, JihperngVolume:
544
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2012.12.074
Date:
October, 2013
File:
PDF, 397 KB
english, 2013