Microstructure analysis of the interface situation and...

Solar Energy Materials and Solar Cells 2013 / 10 Vol. 117

Microstructure analysis of the interface situation and adhesion of thermally formed nickel silicide for plated nickel–copper contacts on silicon solar cells

Mondon, A., Jawaid, M.N., Bartsch, J., Glatthaar, M., Glunz, S.W.
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Volume:
117
Language:
english
Journal:
Solar Energy Materials and Solar Cells
DOI:
10.1016/j.solmat.2013.06.005
Date:
October, 2013
File:
PDF, 1.97 MB
english, 2013
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