Using BP network for ultrasonic inspection of flip chip...

Mechanical Systems and Signal Processing 2013 / 1 Vol. 34; Iss. 1-2

Using BP network for ultrasonic inspection of flip chip solder joints

Su, Lei, Zha, Zheyu, Lu, Xiangning, Shi, Tielin, Liao, Guanglan
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Volume:
34
Language:
english
Journal:
Mechanical Systems and Signal Processing
DOI:
10.1016/j.ymssp.2012.08.005
Date:
January, 2013
File:
PDF, 1.69 MB
english, 2013
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