Electromigration challenges for advanced on-chip Cu...

Microelectronics Reliability 2014 / 04 Vol. 54; Iss. 4

Electromigration challenges for advanced on-chip Cu interconnects

Li, Baozhen, Christiansen, Cathryn, Badami, Dinesh, Yang, Chih-Chao
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.01.005
Date:
April, 2014
File:
PDF, 2.86 MB
english, 2014
Conversion to is in progress
Conversion to is failed