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Reliability of TCT and HH/HT test performed in chips and flex substrates assembled by thermosonic flip-chip bonding process
Aoh, Jong-Ning, Chuang, Cheng-Li, Kang, Min-YiVolume:
53
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2012.08.026
Date:
March, 2013
File:
PDF, 2.03 MB
english, 2013