Scalability of RuTiN barriers deposited by plasma-enhanced...

Microelectronic Engineering 2014 / 05 Vol. 120

Scalability of RuTiN barriers deposited by plasma-enhanced atomic layer deposition for advanced interconnects

Swerts, Johan, Siew, Yong-Kong, Van Besien, Els, Barbarin, Yohan, Opsomer, Karl, Bömmels, Jürgen, Tőkei, Zsolt, Van Elshocht, Sven
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Volume:
120
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2013.08.008
Date:
May, 2014
File:
PDF, 1.02 MB
english, 2014
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