Cohesive failure analysis of an array of IC chips bonded to...

International Journal of Solids and Structures 2013 / 10 Vol. 50; Iss. 22-23

Cohesive failure analysis of an array of IC chips bonded to a stretched substrate

Liu, Zunxu, Valvo, Paolo S., Huang, YongAn, Yin, Zhouping
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Volume:
50
Language:
english
Journal:
International Journal of Solids and Structures
DOI:
10.1016/j.ijsolstr.2013.06.021
Date:
October, 2013
File:
PDF, 3.05 MB
english, 2013
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