Quantitative analysis of the mechanical robustness of...

Quantitative analysis of the mechanical robustness of multilayered bonding pad on a semiconductor device by nanoindentation and nanoscratch tests

Shin, Dong Kil, Im, Jay
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Volume:
531
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2012.12.088
Date:
March, 2013
File:
PDF, 2.14 MB
english, 2013
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