Quantitative analysis of the mechanical robustness of multilayered bonding pad on a semiconductor device by nanoindentation and nanoscratch tests
Shin, Dong Kil, Im, JayVolume:
531
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2012.12.088
Date:
March, 2013
File:
PDF, 2.14 MB
english, 2013