Grain-scale adhesion strength mapping of copper wiring...

Surface and Coatings Technology 2013 / 01 Vol. 215

Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits

Kamiya, Shoji, Shishido, Nobuyuki, Watanabe, Shinsuke, Sato, Hisashi, Koiwa, Kozo, Omiya, Masaki, Nishida, Masahiro, Suzuki, Takashi, Nakamura, Tomoji, Nokuo, Takeshi, Nagasawa, Tadahiro
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Volume:
215
Language:
english
Journal:
Surface and Coatings Technology
DOI:
10.1016/j.surfcoat.2012.07.100
Date:
January, 2013
File:
PDF, 913 KB
english, 2013
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