Direct wafer bonding for encapsulation of fused silica optical gratings
Kalkowski, G., Zeitner, U., Benkenstein, T., Fuchs, J., Rothhardt, C., Eberhardt, R.Volume:
97
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2012.04.020
Date:
September, 2012
File:
PDF, 851 KB
english, 2012