Deep trench etching combining aluminum thermomigration and electrochemical silicon dissolution
G. Gautier, L. Ventura, R. Jérisian, S. Kouassi, C. Leborgne, B. Morillon, M. RoyVolume:
88
Year:
2006
Language:
english
DOI:
10.1063/1.2206120
File:
PDF, 428 KB
english, 2006