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Modeling of Copper CMP Using the Colloidal Behavior of an Alumina Slurry with Copper Nanoparticles
Ihnfeldt, Robin, Talbot, Jan B.Volume:
154
Year:
2007
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2789811
File:
PDF, 272 KB
english, 2007