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The Effects of Copper CMP Slurry Chemistry on the Colloidal Behavior of Alumina Abrasives
Ihnfeldt, Robin, Talbot, Jan B.Volume:
153
Year:
2006
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2335982
File:
PDF, 177 KB
english, 2006