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A Flip-Chip AlGaInP LED with GaN/Sapphire Transparent Substrate Fabricated by Direct Wafer Bonding
Ting, Liang, Xia, Guo, Bao-Lu, Guan, Jing, Guo, Xiao-Ling, Gu, Qiao-Ming, Lin, Guang-Di, ShenVolume:
24
Language:
english
Journal:
Chinese Physics Letters
DOI:
10.1088/0256-307X/24/4/072
Date:
April, 2007
File:
PDF, 249 KB
english, 2007