Mechanism of Migration of Sintered Nanosilver at High Temperatures in Dry Air for Electronic Packaging
Lu, Guo-Quan, Yang, Wen, Mei, Yun-Hui, Li, Xin, Chen, Gang, Chen, XuVolume:
14
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/TDMR.2013.2282041
Date:
March, 2014
File:
PDF, 1.41 MB
english, 2014