[IEEE 2009 4th International Microsystems, Packaging,...

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[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - A study of residual stress effects on CMOS-MEMS microphone technology

Ming-Chih Yew,, Chin-Wen Huang,, Wei-Jr Lin,, Chin-Hung Wang,, Pin Chang,
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Year:
2009
Language:
english
DOI:
10.1109/IMPACT.2009.5382182
File:
PDF, 1.90 MB
english, 2009
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