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[IEEE 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Wroclaw (2013.4.14-2013.4.17)] 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing
Meinshausen, L., Weide-Zaage, K., Fremont, H.Year:
2013
Language:
english
DOI:
10.1109/EuroSimE.2013.6529895
File:
PDF, 1.46 MB
english, 2013