Scallop formation and dissolution of Cu–Sn intermetallic...

Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow

D. Ma, W. D. Wang, S. K. Lahiri
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Volume:
91
Year:
2002
Language:
english
DOI:
10.1063/1.1445283
File:
PDF, 656 KB
english, 2002
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